Aluminum extruded radiator

This is widely used in modern heat dissipation of excellent heat dissipation materials, most of the industry use 6063 T5 high-quality aluminum, its purity can reach more than 98%, its heat conduction ability, low density, low price, so it has been favored by major manufacturers. Considering the thermal resistance and calorific value of Intel and AMD CPU, the extrusion die manufacturer formulates the corresponding die, heating the aluminum ingot to a certain temperature to change its physical form, and then from the die, we can get all kinds of heat sink raw materials we want; then cutting, grooving, grinding and depilating them. Stitching, cleaning and surface treatment can be used.

Aluminum casting radiator

Although aluminium extruded fins are inexpensive and have lower manufacturing costs, due to the soft texture of the aluminium material itself, the ratio of fin thickness to fin height usually does not exceed 1:18, so PC manufacturers are increasing the heat dissipation area, while the heat dissipation space remains unchanged. A more appropriate scheme is to encrypt fins, thereby increasing the number of fins; bend fins, thereby increasing the heat dissipation area; heat aluminum ingots from solid to liquid through the die, and then cool them.

Aluminum cutting radiator

Although this kind of extrusion can not achieve the effect from the heat dissipation area, but now the precision of the die directly affects the overall shape and heat dissipation ability of our radiator, so more manufacturers began to think of cutting the block of aluminum ingots directly to the desired shape with the precision cutting tools of processing machinery. In this way, no deformation will occur in the process of processing, and no impurities will enter the radiator in the process of aluminium extrusion. It can also maximize the heat dissipation area.

Cutting radiator of copper

The aluminium extrusion heat sink used for such a long time, no matter how to change our processing technology, it is difficult to meet the growing CPU calorific value. Some manufacturers have to spare no effort in cost to find copper. Because the thermal conductivity of copper is far greater than that of aluminium, the thermal conductivity of copper increases exponentially. For our heat dissipation, the thermal conductivity of copper increases exponentially. It is of great benefit; however, because the hardness of copper is much greater than that of aluminium, it is a severe test for the process. Therefore, the traditional extrusion process can not be applied to copper, and has to be changed into this cutting method for processing.

Heat sinks for aluminium and copper stacks

One thing we should pay attention to is that cost and profit are always the ultimate goal pursued by manufacturers, so the major manufacturers began to come up with a more optimized scheme to make the copper and aluminium sheets into the various shapes of radiators we want by folding and pressing, and then weld them with suitable radiator plates. The way is linked together, which not only meets the requirements of heat dissipation, but also speeds up the progress of our production, making mass production easier.

Copper-inlaid radiator

The most perfect solution to this compromise solution should be the copper inlay technology initiated by AVC. This is a harmony of the advantages of copper, such as high heat conduction speed, high density and strong heat absorption capacity, with the advantages of light density, low price and convenient mass production of traditional aluminum extrusion.

Copper-inlaid radiator

On the other hand, FOXCONN pioneered to change the part of the radiator bottom contacted with CPU to copper block, which has the characteristics of fast heat absorption and strong heat conduction ability. It can quickly bring a large amount of heat energy generated by CPU operation to the copper block with nickel plated surface, and the heat conducting paste is used to closely combine the copper block with the extruded aluminum radiator to make a large amount of heat transfer. It can quickly diffuse to the aluminium extrusion radiator and be taken away by the fan's rotation.

Pinion fin

Nowadays, with the increasing demand for heat dissipation, the Japanese begin to think of using thin and dense fins to chime with huge pressure on the heat dissipation floor. This technology can be used to combine and match copper and aluminium fins with copper and aluminium base plates arbitrarily. It also effectively avoids the disadvantage of new thermal resistance caused by the unbalanced heat conduction of various solder pastes in the welding process. It enables customers to have more selectivity and diversity of thermal solutions. However, due to the particularity of its processing, the production cost is too high.

Copper-aluminium and heat pipe chimeric radiator

Heat pipe is an important discovery in the field of heat transfer in recent years. It is also the main heat dissipation material first used in notebook computers and major high-end communication industries. Because of its amazing heat conduction speed and the physical characteristics of recycling, our heat dissipation becomes more relaxed and creates unlimited possibilities.